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Allegro PCB SI

Allegro PCB SI参考图片

Allegro PCB SI

厂商: Cadence

描述: Provides advanced interconnect mo...

包装: -

封装: -

无铅情况/ROHS: -

类别: Allegro PCB



Integrated with Cadence® Allegro® PCB design, editing, and routing technologies, Allegro PCB SI provides advanced signal integrity (SI) analysis both pre- and post-layout. Operating early in the design cycle allows for “what-if” scenario exploration, sets more accurate design constraints, and reduces design iterations.

Allegro PCB SI reads and writes directly to the Allegro PCB Editor database for fast and accurate integration of results. It provides a SPICE-based simulator and an embedded field solver, and it supports behavioral modeling with a robust modeling language. Bus architecture can be explored pre-layout to compare alternatives, or post-layout for a comprehensive analysis of all associated signals. The Allegro PCB Power Delivery Network (PDN) Analysis Option provides modeling of all power distribution characteristics.

Features/Benefits
  • Performs a wide variety of SI analyses
  • Reduces design errors to increase first-pass success
  • Sets accurate constraints, quickly and early in the process
  • Improves product performance through solution-space exploration
  • Explores alternative topologies in the earliest stages
  • Supports modeling and testing for multi-gigahertz signals
  • Generates S-Parameters from signal topologies
  • Generates estimated crosstalk tables to increase design efficiency
  • Performs post-layout verifications directly from Allegro PCB Editor
  • Enables device model creation, modification, and verification
  • Verifies multiple-board and silicon-package-board signal paths
  • Analyzes power distribution system characteristics

Application Note

序号 PDF 软件 描述
1 点击下载
Modeling Analog Circuits with Routed Interconnect using AMS and Allegro SI
2 点击下载
Using mm.pl to Create DML MacroModels for Use in Channel Analysis

Cadence Article

序号 PDF 软件 描述
1 点击下载
Interview: Signals on Serial Links: Now you see ‘em, now you don’t. What can we do?

Conference Paper

序号 PDF 软件 描述
1 点击下载
2008 CDNLive MVP Case Study - New Technologies for 6 Gbps Serial Link Design and Simulation
2 点击下载
2009 DesignCon Case Study - New Serial Link Simulation Process, 6 Gbps SAS
3 点击下载
2010 DesignCon Paper Award Finalist - Simulation Techniques for 6+ Gbps Serial Links
4 点击下载
3D S-Parameter Simulation in Allegro SI
5 点击下载
A Process for Serial Link Signal Integrity Analysis - XrossTalk Magazine Article
6 点击下载
Automating FPGA-Based PC Board Designs
7 点击下载
Cadence Signal Integrity for Double Data Rate Interface
8 点击下载
Cadence Signal Integrity for Double Data Rate Interface
9 点击下载
How to Overcome Challenges in Designing a DDR2/DDR3 Memory System
10 点击下载
Using Allegro PCB SI GXL to Make Your Multi-GHz Serial Links Work Right Out of the Box

Datasheet

序号 PDF 软件 描述
1 点击下载
Allegro PCB Power Delivery Network Analysis Datasheet
2 点击下载
Cadence OrCAD PCB SI Datasheet
3 点击下载
Cadence PCB Signal and Power Integrity Datasheet

Downloads

序号 PDF 软件 描述
1 点击下载
Xilinx RocketIO Design Kit

Presentation

序号 PDF 软件 描述
1 点击下载
2008 CDNLive MVP Case Study Presentation - New Technologies for 6 Gbps Serial Link Design and Simulation

Technical Paper

序号 PDF 软件 描述
1 点击下载
Memory Design Considerations when Migrating to DDR3 Interfaces from DDR2

White Paper

序号 PDF 软件 描述
1 点击下载
IR-Drop Analysis White Paper
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