品牌介绍
成立时间2006年 公司位于台湾 高密度无线射频集成芯片电提供者 AcSiP意即Advanced Communication System in Package AcSiP的产品微型化，节约空间，减少工程设计时间
主打产品系列
S200——Wi-Fi SiP
S500——4 in 1 Combo SiP
S601——Wi-Fi + Bluetooth SiP
应用领域
手机
导航装置
连网电脑
行动电视
电子书
产品列表
| 型号 | Operating Temperature | Network Standard | Storage Temperature | Host Interface | Humidity | Dimension |
|---|---|---|---|---|---|---|
| S200 | 0℃ ~ 65℃ | IEEE 802.11b/g Compliant | -45℃ ~ 85℃ | SDIO / eHPI16 / eHPI8 | Operating:10 ~ 95% (Non-Condensing) Storage:5 ~ 95% (Non-Condensing) | 9.0mm X 9.0mm X 1.4mm |
| S500 | 0℃ ~ 65℃ | IEEE 802.11b/g/n, BT 2.1+EDR, FM T/Rx, GPS | -45℃ ~ 85℃ | SDIO / UART / Audio / PCM / I2S | Operating : 10 ~ 95% (Non-Condensing) Storage : 5 ~ 95% (Non-Condensing) | 8.3 mm X 7.4 mm X 1.0 mm (typ.) |
| S601 | 0℃ ~ 65℃ | IEEE 802.11b/g Compliant | -45℃ ~ 85℃ | SDIO / SPI for WiFi , UART and audio PCM for Bluetooth | Operating:10 ~ 95% (Non-Condensing) Storage:5 ~ 95% (Non-Condensing) | 9.5mm X 10.5mm X 1.45mm |
| mSD202 | -20℃ ~ 70℃ | IEEE 802.11b/g/n Compliant | -45℃ ~ 85℃ | SDIO | Operating: Max. 95% (Non-Condensing) | |
| S203L | -20℃ ~ 70℃ | IEEE 802.11b/g/n Compliant | -45℃ ~ 85℃ | SDIO / SPI | Operating: Max 95% (Non-Condensing) | 7mm X 7mm X 1.1mm |
| S205 | 0℃ ~ 65℃ | IEEE 802.11b/g/n Compliant | -45℃ ~ 85℃ | SDIO 2.0 (4-bit & 1-bit) | Operating : 10 ~ 95% (Non-Condensing) Storage : 5 ~ 95% (Non-Condensing) | 9.0mm X 9.0mm X 1.8mm |
| S500M | 0℃ ~ 65℃ | IEEE 802.11b/g/n, BT 2.1+EDR, FM T/Rx, GPS | -45℃ ~ 85℃ | SDIO / UART / Audio / PCM / I2S | • Operating : 10 ~ 95% (Non-Condensing) • Storage : 5 ~ 95% (Non-Condensing) | 8.3 mm X 7.4 mm X 1.0 mm (typ.) |
| S602 | 0℃ ~ 65℃ | IEEE 802.11b/g/n Compliant | -45℃ ~ 85℃ | SDIO / SPI for WiFi, UART and audio PCM for Bluetooth | Operating:10 ~ 95% (Non-Condensing) Storage:5 ~ 95% (Non-Condensing) | 9.5mm X 9.5mm X 1.4mm |
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