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AV8062700849902

AV8062700849902

  • 品牌:Intel
  • 包装:--
  • 无铅情况/ROHS: --
  • 经营商:科通芯城自营
  • 描述:Intel? Celeron? Processor 847E (2M Cache, 1.10 GHz)
  • 封装:--
  • 类别:酷睿处理器
参数 数值
# of Cores 2
# of Displays Supported 2
# of Memory Channels 2
# of PCI Express Ports 16
# of Threads 2
4G WiMAX Wireless Technology No
AES New Instructions No
Bus/Core Ratio 11
Clock Speed 1.1 GHz
Datasheet Url Link
Dual Display Capable Yes
ECC Memory Supported Yes
Embedded Options Available Yes
Enhanced Intel SpeedStep® Technology Yes
Graphics and IMC Lithography 32nm
Graphics Base Frequency 350 MHz
Graphics Max Dynamic Frequency 800 MHz
Graphics Output eDP/DP/HDMI/SDVO/CRT
Idle States Yes
Instruction Set 64-bit
Intel® 64 Yes
Intel® Anti-Theft Technology No
Intel® Clear Video HD Technology No
Intel® Demand Based Switching No
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
Intel® Hyper-Threading Technology No
Intel® InTru™ 3D Technology No
Intel® My WiFi Technology No
Intel® Quick Sync Video No
Intel® Smart Cache 2 MB
Intel® Trusted Execution Technology No
Intel® Turbo Boost Technology No
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) No
Intel® vPro Technology No
Intel® Wireless Display No
Launch Date Q2'11
Lithography 32 nm
Low Halogen Options Available See MDDS
Macrovision* License Required No
Max Memory Bandwidth 21.3 GB/s
Max Memory Size (dependent on memory type) 16 GB
Max TDP 17 W
Memory Types DDR3-1066/1333
Package Size 31mm x 24mm (FCBGA1023)
PCI Express Configurations 1x16, 2x8, 1x8 2x4
PCI Express Revision 2.0
Processor Graphics Intel® HD Graphics
Processor Number 847E
Recommended Customer Price TRAY: $134
Sockets Supported FCBGA1023
Status Launched
T JUNCTION 100
Thermal Monitoring Technologies Yes


这些低功耗处理器基于采用 32 纳米技术的英特尔® 微体系(代号:Sandy Bridge)。此平台提供了高性能、远程可管理性和安全性、ECC 和节能功能,是各种不同的嵌入式应用程序的理想选择。


  • 英特尔® 高级矢量扩展: 加速浮点计算的性能。
  • 英特尔® 核芯显卡 3000 和英特尔® 快速同步视频: 支持高端增强视频和图形功能,并提高性能。
  • 英特尔® 睿频加速技术 2.0: 利用可用的温度余地以更高的频率更快地运行应用程序。
  • 英特尔® 博锐™ 技术: 为关键的安全性和远程管理功能提供前所未有的硬件支持。

交互式结构图



产品简介
序号 PDF 描述
1 产品简介: 第二代英特尔® 酷睿™ i7-2710QE 处理器与英特尔® QM67 高速芯片组开发套件 产品简介: 第二代英特尔® 酷睿™ i7-2710QE 处理器与英特尔® QM67 高速芯片组开发套件
2 产品简介: 第二代智能英特尔® 酷睿™ i7 处理器系列与英特尔® QM67 高速芯片组开发套件 产品简介: 第二代智能英特尔® 酷睿™ i7 处理器系列与英特尔® QM67 高速芯片组开发套件
3 平台简介: 英特尔® 赛扬® 处理器 B810 与移动式英特尔® QM67 高速芯片组和移动式英特尔® HM65 高速芯片组 平台简介: 英特尔® 赛扬® 处理器 B810 与移动式英特尔® QM67 高速芯片组和移动式英特尔® HM65 高速芯片组
4 平台简介:采用英特尔® QM67 高速芯片组和英特尔® HM65 高速芯片组的第二代英特尔® 酷睿™ i7、酷睿™ i5 和酷睿™ i3 处理器。 平台简介:采用英特尔® QM67 高速芯片组和英特尔® HM65 高速芯片组的第二代英特尔® 酷睿™ i7、酷睿™ i5 和酷睿™ i3 处理器。
应用注释
序号 PDF 描述
1 White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors
2 White Paper: High Performance Storage Encryption on Intel® Architecture Processors White Paper: High Performance Storage Encryption on Intel® Architecture Processors
3 White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs
4 White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors
5 White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family
6 White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performa White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performance on Linux*
7 White Paper: Platform-Level error Handling Strategies for Intel® Systems White Paper: Platform-Level error Handling Strategies for Intel® Systems
8 White Paper: Intel® Virtualization Technology for Directed I/O White Paper: Intel® Virtualization Technology for Directed I/O
9 White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors
10 White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms
11 Solution Brief: Going Beyond Exceptional Computing Performance Solution Brief: Going Beyond Exceptional Computing Performance
数据表和规格更新
序号 PDF 描述
1 Datasheet: Intel® 6 Series and Intel® C200 Series Chipset Datasheet: Intel® 6 Series and Intel® C200 Series Chipset
2 Datasheet Addendum: 2nd Generation Intel® Core™ Processor Family Mobile with ECC Datasheet Addendum: 2nd Generation Intel® Core™ Processor Family Mobile with ECC
3 Specification Update: 2nd Generation Intel® Core™ Processor (Mobile) Family Specification Update: 2nd Generation Intel® Core™ Processor (Mobile) Family
4 Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 1 of 2 Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 1 of 2
5 Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 2 of 2 Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 2 of 2
6 Specification Update: Intel® 6 Series and Intel® C200 Series Chipset Specification Update: Intel® 6 Series and Intel® C200 Series Chipset
以太网控制器
序号 PDF 描述
1 Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection
2 Schematic: Intel® 82579 Gigabit Ethernet PHY Schematic: Intel® 82579 Gigabit Ethernet PHY
3 Datasheet: Intel® 82579 Gigabit Ethernet PHY Datasheet: Intel® 82579 Gigabit Ethernet PHY
散热和机械
序号 PDF 描述
1 Thermal Design Guide: 2nd Generation Intel® Core™ Processor (Mobile) Family Thermal Design Guide: 2nd Generation Intel® Core™ Processor (Mobile) Family
2 Application Power Guideline Addendum: 2nd Generation Intel® Core™ i7-2715QE Processor Application Power Guideline Addendum: 2nd Generation Intel® Core™ i7-2715QE Processor
3 Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Ser Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Series Chipset
4 Application Power Guideline Addendum: Intel® Celeron® Processor 807UE Application Power Guideline Addendum: Intel® Celeron® Processor 807UE
5 Application Power Guideline Addendum: Intel® Celeron® Processor 827E Application Power Guideline Addendum: Intel® Celeron® Processor 827E
开发主板和套件
序号 PDF 描述
1 User Guide: 2nd Generation Intel® Core™ Processor Family with Intel® 6 Series Chipset Development Ki User Guide: 2nd Generation Intel® Core™ Processor Family with Intel® 6 Series Chipset Development Kit
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