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AV8063801116903

AV8063801116903

  • 品牌:Intel
  • 包装:--
  • 无铅情况/ROHS: --
  • 经营商:科通芯城自营
  • 描述:Intel? Core? i7-3555LE Processor (4M Cache, up to 3.20 GHz)
  • 封装:--
  • 类别:酷睿处理器
参数 数值
# of Cores 2
# of Displays Supported 3
# of Memory Channels 2
# of PCI Express Ports 1
# of Threads 4
4G WiMAX Wireless Technology No
AES New Instructions Yes
Bus/Core Ratio 25
Clock Speed 2.5 GHz
DMI 5 GT/s
Dual Display Capable Yes
ECC Memory Supported Yes
Embedded Options Available Yes
Enhanced Intel SpeedStep® Technology Yes
Execute Disable Bit Yes
Graphics and IMC Lithography 22nm
Graphics Base Frequency 550 MHz
Graphics Max Dynamic Frequency 1 GHz
Graphics Output eDP/DP/HDMI/SDVO/CRT
Idle States Yes
Instruction Set 64-bit
Instruction Set Extensions AVX
Intel® 64 Yes
Intel® Anti-Theft Technology No
Intel® Clear Video HD Technology Yes
Intel® Clear Video Technology for MID No
Intel® Demand Based Switching No
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
Intel® Flexible Display Interface (Intel® FDI) Yes
Intel® Hyper-Threading Technology Yes
Intel® Insider™ No
Intel® InTru™ 3D Technology Yes
Intel® My WiFi Technology Yes
Intel® Quick Sync Video Yes
Intel® Smart Cache 4 MB
Intel® Trusted Execution Technology Yes
Intel® Turbo Boost Technology 2.0
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® vPro Technology Yes
Intel® VT-x with Extended Page Tables (EPT) Yes
Intel® Wireless Display No
Launch Date Q2'12
Lithography 22nm
Low Halogen Options Available See MDDS
Max CPU Configuration 1
Max Memory Bandwidth 25.6 GB/s
Max Memory Size (dependent on memory type) 32 GB
Max TDP 25 W
Max Turbo Frequency 3.2 GHz
Memory Types DDR3/DDR3L - 1333/1600
Package Size 31.0mm x 24.0mm
PCI Express Configurations 1x16, 2x8, 1x8 2x4
PCI Express Revision 3.0
Processor Graphics Intel® HD Graphics 4000
Processor Number i7-3555LE
Recommended Customer Price TRAY: $360
Sockets Supported FCBGA1023
Status Launched
T JUNCTION 105°C
Thermal Monitoring Technologies Yes


这些低功耗处理器基于原名为 Ivy Bridge 的英特尔® 微体系结构,后者采用具有 3D 晶体管的 22 纳米处理技术。此平台提供了高性能、远程可管理性和安全性、ECC 内存和节能功能,是各种不同的移动智能应用程序的理想选择。


  • 采用英特尔® 核芯显卡 4000/2500: 提供增强型视觉体验,包括非凡的 3D 性能以及三台独立显示器的支持。
  • 英特尔® 高速视频同步技术: 显著提升解码和转码性能并腾出 CPU 用于其他任务。
  • 新一代 I/O: 更快连接,而且支持集成型 PCI Express 第三代和 USB 3.0。
  • 英特尔® 博锐™ 技术: 为关键的安全性和远程管理功能提供前所未有的硬件支持。
  • 英特尔® 智能节能技术: 通过诸如集成功率门限和自动低功耗状态等架构方面的提高以降低闲置功耗。

交互式结构图



以太网控制器
序号 PDF 描述
1 Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection
2 Schematic: Intel® 82579 Gigabit Ethernet PHY Schematic: Intel® 82579 Gigabit Ethernet PHY
3 Datasheet: Intel® 82579 Gigabit Ethernet PHY Datasheet: Intel® 82579 Gigabit Ethernet PHY
产品简介
序号 PDF 描述
1 平台简介:采用移动式英特尔® HM76 和 QM77 高速芯片组的智能英特尔® 酷睿™ i7 和酷睿™ i5 处理器 平台简介:采用移动式英特尔® HM76 和 QM77 高速芯片组的智能英特尔® 酷睿™ i7 和酷睿™ i5 处理器
数据表和规格更新
序号 PDF 描述
1 Datasheet: Intel® 7 Series and Intel® C216 Chipset Datasheet: Intel® 7 Series and Intel® C216 Chipset
2 Specification Update: 3rd Generation Intel® Core™ Processor (Mobile) Family Specification Update: 3rd Generation Intel® Core™ Processor (Mobile) Family
3 Datasheet: 3rd Generation Intel® Core™ Processor (Mobile) Family - Volume 1 of 2 Datasheet: 3rd Generation Intel® Core™ Processor (Mobile) Family - Volume 1 of 2
4 Datasheet: 3rd Generation Intel® Core™ Processor (Mobile) Family - Volume 2 of 2 Datasheet: 3rd Generation Intel® Core™ Processor (Mobile) Family - Volume 2 of 2
5 Specification Update: Intel® 7 Series and Intel® C216 Chipset Specification Update: Intel® 7 Series and Intel® C216 Chipset
散热和机械
序号 PDF 描述
1 Application Power Guideline Addendum: 3rd Generation Intel® Core™ i7 Processor Application Power Guideline Addendum: 3rd Generation Intel® Core™ i7 Processor
应用注释
序号 PDF 描述
1 White Paper: Improved Graphics Performance Changes the Cost Equation in Digital Signage White Paper: Improved Graphics Performance Changes the Cost Equation in Digital Signage
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