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NTCG064KH302HTB

NTCG064KH302HTB

  • 品牌:TDK
  • 包装:Punched (Paper)Taping [180mm Reel]
  • 无铅情况/ROHS: --
  • 经营商:科通芯城自营
参数 数值
类型 Chip Type
最少供货数-Nom 15000Pcs
公称B常数(B25/50)-Typ 4498K
最少包装数-Nom 15000Pcs
重量-Nom 0.0003g
使用温度范围-Max 125Cel
最大功率-Max 35 mW
公称零负荷电阻值的容许差 +/-3%
尺寸代码 0603
包装形式 Punched (Paper)Taping [180mm Reel]
依据国际标准 JIS C 2570
适用焊接方法 Reflow
公称B常数(B25/85)-Typ 4500K
公称零符合电阻值-Typ 3 kOhm
表面安装分类 No
主体横宽(L)-Nom 0.6 mm
保存温度范围-Min -40Cel
使用温度范围-Min -40Cel
主体纵长(W)-Nom 0.3 mm
公称B常数的容许差 +/-3%
主体高度(T)-Nom 0.3 mm
保存温度范围-Max 125Cel

概要
This product is suited for the reduction of mounting area by the small type (0.6x0.3x0.3mm).It can choose from wide range resistance series.From 30ohms to 1Mohm
用途
CELLULAR,PC,ODD,BATTERY,LCD,PRINTER,HDD,BASE STATION,POWER AMP,etc
特点
This product include no lead and applies to the EU Council Directive 2002/95/EC RoHS.This product realized excellent solderablity and soldering heat resistance, comparing with the conventional eutectic mixture solder and lead-free solder (Sn/Ag/Cu, etc.).The 0603, 1608 and 1005 types provide 3 different shapes with identical resistance-temperature characteristics.By using layered internal electrode structure, product series provides a wide range of resistances - B constants and realized good stability of resistance value after soldering.

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